The soldering terminals are glued at a distance of 1 to 5 mm from the strain gauge. They serve as soldering surfaces for the internal wiring of the bridge circuit and for soldering on the connecting cable.
The CEG (epoxy) version has an epoxy resin carrier (robust) and is particularly suitable for flat surfaces. The CPF version has a polyimide carrier (flexible) and is particularly suitable for curved surfaces.
The "d" variant is specifically for 3-wire connections.
Size 50 is suitable for grid sizes 1.5 mm to 3 mm.